Search Results - Abdullah, Muhammad Khalil

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  1. 1
    Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb].

    Modelling And Analysis Of Stacked-Chip Scale Packages (S-Csps) Encapsulation Process Using Finite Difference Method [TK7874. K46 2007 f rb]. by Abdullah, Muhammad Khalil

    Published 2006
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    The effect of wick structure and filling ratio to the vapour chamber performance in electronic cooling system using an experimental method / Fairosidi Idrus ... [et al.]

    The effect of wick structure and filling ratio to the vapour chamber performance in electronic cooling system using an experimental method / Fairosidi Idrus ... [et al.] by Idrus, Fairosidi, Yaakob, Yusli, Abdul Razak, Muhammad, Mohamed, Mazlan, Abd. Razak, Azli, Abdullah, Mohd Zulkifly, Abdullah, Muhammad Khalil

    Published 2011
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