Initial studies into the use of ultrasound to reduce process temperatures and chemical usage in the PCB desmear process

by Andrew J., Cobley, Lindsay, Edgar, Martin, Goosey, Rod, Kellner, Timothy J., Mason
Published 2011

Implementation of the RoHS directive and compliance implications for the PCB sector

by Martin, Goosey
Published 2007

New technologies for a sustainable printed circuit board manufacturing process: further results

by Narinder, Bains, Kate, Geraghty, Martin, Goosey
Published 2006

Energy conservation and related best practices in printed circuit board (PCB) manufacturing

by Martin, Goosey, Rod, Kellner
Published 2010

Recovery of copper from PCB manufacturing effluent using chitin and chitosan

by Martin, Goosey, Rod, Kellner
Published 2012

Advanced surface protection for improved reliability PCB systems (ASPIS)

by Andy, Ballantyne, Greg, Forrest, Martin, Goosey, Asta, Griguceviciene, Jurga, Juodkazyte, Rod, Kellner, Aleksandr, Kosenko, Rimantas, Ramanauskas, Karl, Ryder, Algirdas, Selskis, Rima, Tarozaite, Erik, Veninga
Published 2012

A short introduction to graphene and its potential interconnect applications

by Martin, Goosey
Published 2012

Water use in the printed circuit board manufacturing process and approaches for reducing consumption

by Martin, Goosey
Published 2005

New technologies for a sustainable printed circuit board manufacturing process: initial results

by Narinder, Bains, Kate, Geraghty, Martin, Goosey
Published 2005

Soldering considerations for lead‐free printed circuit board assembly – an Envirowise Guide

by Martin, Goosey
Published 2005

End‐of‐life electronics legislation – an industry perspective

by Martin, Goosey
Published 2004

Factors influencing the formation of “black pad” in electroless nickel‐immersion gold solderable finishes—a processing perspective

by Martin, Goosey
Published 2002

Evaluation of an enhanced oxidation method for the destruction of ethylene diamine tetra‐acetic acid (EDTA) and related compounds in aqueous solution

by Narinder, Bains, Martin, Goosey, Runveer, Hayer
Published 2003

Recycling technologies for the treatment of end of life printed circuit boards (PCBs)

by Martin, Goosey, Rod, Kellner
Published 2003

An overview of the current status of lead‐free assembly and related issues

by Martin, Goosey
Published 2003

A new method for destroying organic contaminants and recycling waste water from printed circuit board manufacturing process effluent streams

by Neil, Wright, Martin, Potter, Narinder, Bains, Martin, Goosey
Published 2003

An introduction to high performance laminates and the importance of using optimised chemical processes in PCB fabrication

by Martin, Goosey, Mark, Poole
Published 2004

Environmental best practice in the PCB industry

by Martin, Goosey
Published 2000

Development of a new, more efficient and environmentally friendly method of producing high density interconnects – the “PRIME” process

by David, Albin, Jean‐Claude, Rames, Claudia, Dietel, Kai, Lenfert, Stephanie, Rossi, David, Starkey, Joel, Down, Ricard, Pineda, Juan, Carlos Sardon, Martin, Goosey, John, Graves, Narinder, Bains, Frank, Cristoph, Frank, Smeets, Willy, Gilen
Published 2001

Introduction

by Martin, Goosey
Published 2002