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1
Effects of rubber-modified on thermal and mechanical properties of epoxy mold compound
by
Husna Zayadi
Published 2010
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2
Effects of power and force during wire bonding process on wire pull strength for QFN stacked die
by
Husna Zayadi
Published 2008
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Journal
3
Stereometry of voids in solder interconnect between PCB and packaging
by
Husna Zayadi
Published 2008
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4
Challenge in free air balls formation of copper during thermosonic wire bonding process
by
Husna Zayadi
Published 2008
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5
Effects of USG current and bonding load on bonding formation in QFN stacked die package
by
Husna Zayadi
Published 2008
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6
Some aspects on free air ball (FAB) formation of copper wire bonding
by
Husna Zayadi
Published 2008
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7
Effect of ultrasonic energy and force on intermetallic growth patterns for 2N gold wire
by
Husna Zayadi
Published 2008
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8
Effects of parameter match on bondability and reliability in thermosonic gold bonding
by
Husna Zayadi
Published 2008
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